EDS15

EDS15 - Wafer to Wafer Die Sort： Key features of EDS-15 Die Sorter: Handles wafer sizes up to 300mm Machine throughput up to 20,000 UPH Ability to handle die size of 04×02 mm or larger

TS201

TS201 - Turret-Based Test Handler： Estek offers turret-based Vision Inspection and back-end finishing process equipment for LED, ICs and discrete components to the semiconductor industry.

UDM100

UDM100 - De-panelling System Smart Solution for Semicon Packaging： Estek offers solutions for the entire spectrum for Integrated circuit depaneling operation. Our product range focuses on modern processes in electronic component production.

EWS10

EWS100 - Advanced Optical Inspection For Semiconductor Industry Advanced Motion couple with our vision systems provide dramatically improved positioning and alignment capability.User-friendly software improves efficiency and provides compatibility.